JPH0567069B2 - - Google Patents
Info
- Publication number
- JPH0567069B2 JPH0567069B2 JP62192832A JP19283287A JPH0567069B2 JP H0567069 B2 JPH0567069 B2 JP H0567069B2 JP 62192832 A JP62192832 A JP 62192832A JP 19283287 A JP19283287 A JP 19283287A JP H0567069 B2 JPH0567069 B2 JP H0567069B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- resin body
- metal layer
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19283287A JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19283287A JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6437043A JPS6437043A (en) | 1989-02-07 |
| JPH0567069B2 true JPH0567069B2 (en]) | 1993-09-24 |
Family
ID=16297720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19283287A Granted JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437043A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5600181A (en) * | 1995-05-24 | 1997-02-04 | Lockheed Martin Corporation | Hermetically sealed high density multi-chip package |
| JP2002058172A (ja) | 2000-08-11 | 2002-02-22 | Denso Corp | 車両用交流発電機の電圧制御装置 |
| TWI540698B (zh) | 2010-08-02 | 2016-07-01 | 日月光半導體製造股份有限公司 | 半導體封裝件與其製造方法 |
| US10128164B2 (en) | 2014-10-29 | 2018-11-13 | Hitachi Automotive Systems, Ltd. | Electronic device and method of manufacturing the electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5165664U (en]) * | 1974-11-15 | 1976-05-24 | ||
| JPS5972748A (ja) * | 1982-10-20 | 1984-04-24 | Nec Kyushu Ltd | 半導体装置 |
| JPS59151446U (ja) * | 1983-03-30 | 1984-10-11 | 株式会社東芝 | 半導体装置 |
-
1987
- 1987-07-31 JP JP19283287A patent/JPS6437043A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6437043A (en) | 1989-02-07 |
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